Low profile sensor packages
AssigneeStmicroelectronics Pte Ltd
InventorJing-En LUAN
Life of this patent
Estimating the term…
Abstract
The present disclosure is directed to embodiments of optical sensor packages. For example, at least one embodiment of an optical sensor package includes a light-emitting die, a light-receiving die, and an interconnect substrate within a first resin. A first transparent portion is positioned on the light-emitting die and the interconnect substrate, and a second transparent portion is positioned on the light-receiving die and the interconnect substrate. A second resin is on the first resin, the interconnect substrate, and the first and second transparent portions, respectively. The second resin partially covers respective surfaces of the first and second transparent portions, respectively, such that the respective surfaces are exposed from the second resin.
Claims20
A method, comprising:
- forming a first resin covering respective sidewalls of a first die, a second die, and an interconnect substrate, the first resin spaces apart the first die, the second die, and the interconnect substrate from each other, the first die having a first surface, the second die having a second surface, the interconnect substrate having a third surface, the first resin includes a fourth surface substantially coplanar with the first, second, and third surfaces;
- coupling the first die and the second die to the interconnect substrate by a plurality of wires;
- providing a first transparent portion;
- providing a second transparent portion adjacent to the first transparent portion;
- and
- forming a second resin on the interconnect substrate, on the first resin, on the first transparent portion, and on the second transparent portion.
A method, comprising:
- forming a first resin on respective sidewalls of a first die, a second die, and an interconnect substrate between ones of the respective sidewalls of the first and second die, the interconnect substrate spacing apart the ones of the respective sidewalls of the first and second die;
- coupling the first die and the second die to the interconnect substrate by a plurality of wires;
- providing a first transparent portion on the first die and the interconnect substrate;
- providing a second transparent portion on the second die and the interconnect substrate;
- and
- forming a second resin on the interconnect substrate, on the first resin, on the first transparent portion, on the second transparent portion, and between the first and second transparent portions.
Dependencies are inferred from the claim text.