Outer bending leadframe technology

An apparatus comprising:

• a direct bonded metal (DBM) substrate including at least a metal layer coupled to an insulating layer;
• and
• a leadframe of a package including an inner conductive portion and an outer conductive portion, wherein the outer conductive portion includes a first conductor provided at a first lateral position, a second conductor provided at a second lateral position that is disposed below the first lateral position, and an outer angled portion coupling the first conductor to the second conductor;
• wherein the inner conductive portion includes an inner angled portion and is coupled to the metal layer of the DBM substrate;
• wherein the inner conductive portion is configured to be disposed in a molding material of the package;
• wherein at least the second conductor and the outer angled portion of the outer conductive portion are configured to be disposed outside of the molding material of the package;
• and
• wherein at least the second conductor and the outer angled portion of the outer conductive portion are configured to be cut or trimmed away from the package.

A method, comprising:

• forming a leadframe of a package including an inner conductive portion and an outer conductive portion, wherein the outer conductive portion includes a first conductor provided at a first lateral position, a second conductor provided at a second lateral position that is disposed below the first lateral position, and an outer angled portion coupling the first conductor to the second conductor, and wherein the inner conductive portion includes an inner angled portion;
• coupling the inner conductive portion to a metal layer of a direct bonded metal (DBM) substrate;
• and
• forming a molding material of the package, wherein the inner conductive portion is disposed in the molding material of the package, and wherein at least the second conductor and the outer angled portion of the outer conductive portion are disposed outside of the molding material of the package.