H10W 72/07541
Controlling the environment
Official title: {Controlling the environment, e.g. atmosphere composition or temperature}
H10W72/07541 (Controlling the environment) appears on 191 US grants and 156 published applications in this corpus.
Search patents in H10W- Granted patents
- 191
- Published applications
- 156
- Assignees
- 87
- Inventors
- 408
- Latest grant
- 28 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 2 | 0 |
| 1986 | 5 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 5 | 0 |
| 1991 | 4 | 0 |
| 1992 | 4 | 0 |
| 1993 | 4 | 0 |
| 1994 | 4 | 0 |
| 1995 | 3 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 2 | 0 |
| 1999 | 4 | 0 |
| 2000 | 3 | 0 |
| 2001 | 6 | 1 |
| 2002 | 6 | 3 |
| 2003 | 4 | 6 |
| 2004 | 5 | 7 |
| 2005 | 4 | 4 |
| 2006 | 4 | 3 |
| 2007 | 5 | 7 |
| 2008 | 1 | 8 |
| 2009 | 4 | 7 |
| 2010 | 4 | 16 |
| 2011 | 8 | 12 |
| 2012 | 11 | 12 |
| 2013 | 5 | 4 |
| 2014 | 8 | 5 |
| 2015 | 9 | 6 |
| 2016 | 4 | 0 |
| 2017 | 3 | 14 |
| 2018 | 10 | 9 |
| 2019 | 7 | 4 |
| 2020 | 7 | 5 |
| 2021 | 3 | 5 |
| 2022 | 5 | 7 |
| 2023 | 3 | 5 |
| 2024 | 3 | 3 |
| 2025 | 6 | 3 |
| 2026 | 3 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Handling a fragile substrate for interconnect bonding28 Jul 2026US 12,696,783 B2Asmpt Singapore Pte. Ltd.
- Bonding wire for semiconductor devices17 Mar 2026US 12,581,982 B2Nippon Micrometal Corporation
- Wire guide module, and ultrasonic wire bonder therewith20 Jan 2026US 12,528,135 B2
- Semiconductor package substrate with groove on die pad18 Nov 2025US 12,476,204 B2Texas Instruments Incorporated
- Wire bonding apparatus, method for manufacture of semiconductor device, and semiconductor device16 Sep 2025US 12,417,997 B2Kabushiki Kaisha Shinkawa
- Semiconductor package and method of fabricating the same20 Nov 2025US 2025/0357401 A1Samsung Electronics Co., Ltd.
- Adhesive film for semiconductors, dicing die bonding film, and method for manufacturing semiconductor device19 Jun 2025US 2025/0197687 A1Resonac Corporation
- Bonding wire10 Apr 2025US 2025/0114877 A1Nippon Micrometal Corporation
- Pin wire forming method, wire bonding apparatus, and bonding tool14 Nov 2024US 2024/0379613 A1Kabushiki Kaisha Shinkawa
- Handling a fragile substrate for interconnect bonding13 Jun 2024US 2024/0194634 A1Asmpt Singapore Pte. Ltd.
Most cited
By later US patents
- Ultrasonic bonding process87US 5,660,319 ATexas Instruments Incorporated · 1997
- Control of size and heat affected zone for fine pitch wire bonding78US 6,180,891 B2International Business Machines Corporation · 2001
- Lead frame wire bonding by preheating74US 4,434,347 AFairchild Camera and Instrument Corporation · 1984
- Method and apparatus for wire bond68US 5,176,310 AHitachi, Ltd. · 1993
- Micro-surface welding60US 4,171,477 AInternational Business Machines Corporation · 1979