Ultrasonic bonding process
AssigneeTexas Instruments Incorporated
InventorsRobert J. Falcone, Timothy J. Hogan
Life of this patent
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Abstract
A method for bonding a metal wire (17) to a metal bond site (16) utilizes an ultrasonic power source (12) that is at approximately 162 KHz. A mash force is applied from a pressure source (13) during bonding. A metal exchange takes place between the metal wire (17) and the bond site (16) during the application of the ultrasonic power to produce a strong bond between the metal wire (17) and the bond site (16).
Claims19
A method of forming an bond structure, comprising the steps of:
- providing a conductive metal bond site;
- providing a conductive metal wire having a bond end;
- contacting the bond end of the wire to the bond site such that the bond end and the bond site present an interface therebetween;
- and
- applying ultrasonic energy at the interface at a frequency of approximately 162 KHz to form an electrical bond between the bond site and wire bond end.
A method of forming a metallic bond structure, comprising the steps of:
- providing a conductive metal bond site;
- providing a conductive metal wire having a bond end;
- contacting the bond end of the wire to the bond site such that the bond end and the bond site present an interface therebetween;
- applying ultrasonic energy at the interface at a frequency of approximately 162 KHz to form an electrical bond between the bond site and wire bond end;
- and
- applying a mash force to the metal wire on the bond site during the time the ultrasonic energy is applied at the interface.
A method of forming an aluminum bond structure, comprising the steps of:
- providing a conductive aluminum bond site;
- providing a conductive aluminum wire having a bond end;
- contacting the bond end of the wire to the bond site such that the bond end and the bond site present an interface therebetween;
- and
- applying ultrasonic energy at the interface at a frequency between 150 and 165 KHz to form an electrical bond between the bond site and wire bond end.
Dependencies are inferred from the claim text.