Wire bonding apparatus, method for manufacture of semiconductor device, and semiconductor device

A method for manufacture of a semiconductor device by connecting a first bonding point and a second bonding point to each other with a wire using a capillary, the method comprising:

• a first step in which, after a free air ball is formed at a tip of the wire inserted through the capillary, the capillary descends to a prescribed pressure bonding height toward the first bonding point to deform the free air ball formed at a tip of the wire into a pressure bonded ball and a column part positioned over the pressure bonded ball at the first bonding point, wherein the prescribed pressure bonding height is determined based on a thickness of the pressure bonded ball;
• a second step in which the column part is scraped off using the capillary by making the capillary move horizontally without rising at the pressure bonding height after execution of the first step;
• and
• a third step in which the capillary is moved in a forward direction that is a direction of approaching the second bonding point at a movement height higher than the pressure bonding height and the wire is folded back without being cut, and a pressing operation for causing the capillary to ascend and descend such that a wire portion overlapping the pressure bonded ball is pressed down using the capillary is repeated at least once during movement after execution of the second step.