H10W 72/07521
Aligning
Official title: {Aligning}
H10W72/07521 (Aligning) appears on 1,178 US grants and 1,076 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,178
- Published applications
- 1,076
- Assignees
- 302
- Inventors
- 2,017
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 6 | 0 |
| 1985 | 4 | 0 |
| 1986 | 5 | 0 |
| 1987 | 4 | 0 |
| 1988 | 5 | 0 |
| 1989 | 9 | 0 |
| 1990 | 11 | 0 |
| 1991 | 12 | 0 |
| 1992 | 22 | 0 |
| 1993 | 13 | 0 |
| 1994 | 17 | 0 |
| 1995 | 15 | 0 |
| 1996 | 7 | 0 |
| 1997 | 22 | 0 |
| 1998 | 12 | 0 |
| 1999 | 36 | 0 |
| 2000 | 36 | 0 |
| 2001 | 54 | 20 |
| 2002 | 44 | 50 |
| 2003 | 38 | 53 |
| 2004 | 35 | 34 |
| 2005 | 32 | 57 |
| 2006 | 41 | 57 |
| 2007 | 27 | 49 |
| 2008 | 29 | 51 |
| 2009 | 25 | 51 |
| 2010 | 46 | 77 |
| 2011 | 39 | 59 |
| 2012 | 50 | 48 |
| 2013 | 52 | 48 |
| 2014 | 43 | 37 |
| 2015 | 48 | 61 |
| 2016 | 59 | 45 |
| 2017 | 40 | 46 |
| 2018 | 39 | 45 |
| 2019 | 29 | 33 |
| 2020 | 37 | 31 |
| 2021 | 23 | 28 |
| 2022 | 26 | 32 |
| 2023 | 18 | 25 |
| 2024 | 26 | 16 |
| 2025 | 19 | 12 |
| 2026 | 14 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor apparatus and semiconductor apparatus manufacturing method1 Sep 2026US 12,727,524 B2Fuji Electric Co., Ltd.
- Imaging element package, method of manufacturing the same, and electronic device25 Aug 2026US 12,720,878 B2Sony Semiconductor Solutions Corporation
- Handling a fragile substrate for interconnect bonding28 Jul 2026US 12,696,783 B2Asmpt Singapore Pte. Ltd.
- Semiconductor device package with wettable flanks14 Jul 2026US 12,685,207 B2Texas Instruments Incorporated
- Apparatus and methods for tool mark free stitch bonding7 Jul 2026US 12,677,378 B2Skyworks Solutions, Inc.
- Microelectronic device package with open cavity1 Oct 2026US 2026/0305456 A1Texas Instruments Incorporated
- Wirebonding systems and related methods17 Sep 2026US 2026/0282990 A1Semiconductor Components Industries, LLC
- Capillary head with noncircular cone for wirebonding in semiconductor package manufacturing27 Aug 2026US 2026/0256014 A1
- Methods of determining a sequence for creating a plurality of wire loops in connection with a workpiece13 Aug 2026US 2026/0234412 A1Kulicke and Soffa Industries, Inc.
- Electronic Assembly, Electronic Device, and Preparation Method for Electronic Assembly6 Aug 2026US 2026/0231809 A1Huawei Technologies Co., Ltd.
Most cited
By later US patents
- Semiconductor device475US 6,316,838 B1Fujitsu Limited · 2001
- Surface mount plastic package semiconductor integrated circuit, manufacturing method thereof, as well as mounting method and mounted structure thereof247US 4,920,074 AHitachi, Ltd. · 1990
- Semiconductor device and method of manufacturing the same219US 6,100,594 ASharp Kabushiki Kaisha · 2000
- Semiconductor device package and method of making such a package214US 5,173,766 ALSI Logic Corporation · 1992
- Semiconductor package having stacked semiconductor chips and method of making the same208US 6,555,917 B1Amkor Technology, Inc. · 2003