H10W 72/07523
Active alignment
Official title: {Active alignment, e.g. using optical alignment using marks or sensors}
H10W72/07523 (Active alignment) appears on 81 US grants and 85 published applications in this corpus.
Search patents in H10W- Granted patents
- 81
- Published applications
- 85
- Assignees
- 36
- Inventors
- 152
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 1 |
| 2002 | 1 | 1 |
| 2003 | 0 | 1 |
| 2004 | 3 | 0 |
| 2005 | 1 | 3 |
| 2006 | 2 | 5 |
| 2007 | 3 | 8 |
| 2008 | 5 | 3 |
| 2009 | 3 | 5 |
| 2010 | 6 | 2 |
| 2011 | 1 | 3 |
| 2012 | 3 | 2 |
| 2013 | 1 | 2 |
| 2014 | 2 | 4 |
| 2015 | 5 | 4 |
| 2016 | 3 | 3 |
| 2017 | 2 | 3 |
| 2018 | 3 | 6 |
| 2019 | 5 | 5 |
| 2020 | 7 | 4 |
| 2021 | 2 | 2 |
| 2022 | 5 | 6 |
| 2023 | 1 | 3 |
| 2024 | 3 | 5 |
| 2025 | 4 | 2 |
| 2026 | 4 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor apparatus and semiconductor apparatus manufacturing method1 Sep 2026US 12,727,524 B2Fuji Electric Co., Ltd.
- Method of manufacturing semiconductor device24 Feb 2026US 12,564,070 B2Renesas Electronics Corporation
- Semiconductor package with blast shielding6 Jan 2026US 12,519,069 B2Texas Instruments Incorporated
- Method of manufacturing a semiconductor package and semiconductor package manufactured by the same6 Jan 2026US 12,519,082 B2SK hynix Inc.
- Semiconductor device28 Oct 2025US 12,456,669 B2Sony Semiconductor Solutions Corporation
- Capillary head with noncircular cone for wirebonding in semiconductor package manufacturing27 Aug 2026US 2026/0256014 A1
- Method of manufacturing a semiconductor package and semiconductor package manufactured by the same21 May 2026US 2026/0143722 A1SK hynix Inc.
- Semiconductor devices including recognition marks26 Jun 2025US 2025/0210539 A1SK hynix Inc.
- Method of manufacturing semiconductor device1 May 2025US 2025/0140740 A1Renesas Electronics Corporation
- Semiconductor package with blast shielding8 Aug 2024US 2024/0266306 A1Texas Instruments Incorporated
Most cited
By later US patents
- Method of making fine wire interconnections129US 4,437,604 AKulicke and Soffa Industries, Inc. · 1984
- Semiconductor device and method of manufacturing the same106US 7,456,091 B2Renesas Technology Corp. · 2008
- Semiconductor components having through wire interconnects (TWI)77US 7,307,348 B2Micron Technology, Inc. · 2007
- Semiconductor component having through wire interconnect (TWI) with compressed wire73US 8,193,646 B2Micron Technology, Inc. · 2012
- Pattern recognition apparatus and a pattern recognition method65US 4,651,341 AFujitsu Limited · 1987