Method of manufacturing semiconductor device

A method of manufacturing a semiconductor device, the method comprising:

• (a) preparing a semiconductor chip including a main surface, a pad formed on the main surface, and an insulating film formed on the main surface;
• (b) bonding a wire to a bonding region of the pad, wherein the bonding region is exposed from the insulating film in an opening portion formed in the insulating film;
• and
• (c) after the (b), determining a quality as to whether or not a bonding portion of the wire is located within the bonding region in plan view,
• wherein the opening portion includes a main opening portion including the bonding region,
• wherein, in plan view, the main opening portion includes:
• a first side extending in a first direction;
• a second side extending in a second direction intersecting the first direction;
• a third side extending in the second direction and located on a side opposite the second side;
• a fourth side extending in the first direction and located on a side opposite the first side;
• a first corner portion including an intersection between the first side and an extended line of the second side or an intersection between the first side and the second side;
• a second corner portion including an intersection between the first side and the third side or an intersection between the first side and an extended line of the third side;
• a third corner portion including an intersection between the fourth side and the second side or an intersection between the fourth side and an extended line of the second side;
• and
• a fourth corner portion including an intersection between the fourth side and an extended line of the third side or an intersection between the fourth side and the third side,
• wherein the insulating film includes a plurality of position determining opening patterns arranged in a region located around the main opening portion in plan view,
• wherein, in each of the first side and the fourth side of the main opening portion, when an extended line extending in a direction from the third side toward the second side in plan view is defined as a first extended line and an extended line extending in a direction from the second side toward the third side in plan view is defined as a second extended line, the plurality of position determining opening patterns includes:
• a first position determining opening pattern located between the first extended line of the first side and the first extended line of the fourth side in the second direction and arranged at a position closest to the first corner portion among the first corner portion, the second corner portion, the third corner portion, and the fourth corner portion of the main opening portion;
• and
• a second position determining opening pattern located between the second extended line of the first side and the second extended line of the fourth side in the second direction and arranged at a position closest to the third corner portion or the fourth corner portion among the first corner portion, the second corner portion, the third corner portion, and the fourth corner portion of the main opening portion,
• wherein the wire includes:
• a first end portion including the bonding portion having a bonding surface, which is a bonding interface with the pad;
• and
• an extending portion connected to the first end portion, extending in a third direction intersecting each of the first direction and the second direction in plan view, and intersecting the first side of the main opening portion in plan view,
• wherein the bonding region has a rectangular shape having an area smaller than an opening area of the main opening portion in plan view,
• wherein the bonding region is defined by the first position determining opening pattern, the second position determining opening pattern, the second side, and the third side, and
• wherein, in the (c), the quality is determined based on whether or not a whole of the bonding portion is located within the bonding region.