Method of manufacturing semiconductor device

A method of manufacturing a semiconductor device, comprising steps of:

• (a) preparing a semiconductor chip having a main surface, a pad formed on the main surface, and an insulating film formed on the main surface;
• (b) after the step of (a), specifying a bonding region in a portion of the pad exposed in an opening portion formed in the insulating film;
• and
• (c) after the step of (b), connecting a bonding wire to the bonding region of the pad,
• wherein a planar shape of the pad has a quadrangular shape including a first side and a second side intersecting the first side,
• wherein a planar shape of the opening portion has a quadrangular shape including a first side and a second side intersecting the first side,
• wherein the first side of the pad or the first side of the opening portion is further provided with a first marker,
• wherein the second side of the pad or the second side of the opening portion is further provided with a second marker,
• wherein the first marker has a first line segment orthogonal to the first side at a first position of the first side,
• wherein the second marker has a first line segment orthogonal to the second side at a first position of the second side,
• wherein, in the step of (b), the bonding region is specified by having a horizontal line partially constituting crosshairs displayed on a monitor of a wire bonding apparatus superimposed on the first line segment of the first marker, and having a vertical line partially constituting the crosshairs superimposed on the first line segment of the second marker.