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US 2026/0282990 A1Published application
Wirebonding systems and related methods
AssigneeSemiconductor Components Industries, LLC
InventorsIan Ceazar Bucayon BARIAS, Lijuan WANG, Sen SUN, Jipeng HUANG, ZhenYu XU
Life of this patent
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Abstract
Implementations of a method of wirebonding may include providing a bond wire; forming a first wirebond on a surface of a substrate using a bond head and lifting the bond head away from the bond wire a predetermined distance, causing the bond wire to lift from the surface of the substrate. The method may include cutting the bond wire and forming a second wirebond on the surface of the substrate using the bond head.
Claims15
1-6. (canceled)
A method of wirebonding comprising:
- providing a bond wire;
- forming a first wirebond on a surface of a substrate using a bond head;
- lifting the bond head away from the bond wire a predetermined distance, causing the bond wire to lift from the surface of the substrate;
- cutting the bond wire;
- and
- forming a second wirebond on the surface of the substrate using the bond head.
3 more elements
A method of wirebonding comprising:
- providing a bond wire;
- placing the bond wire adjacent to a surface of a substrate using a bond head;
- lifting the bond head away from the bond wire a predetermined distance, causing the bond wire to lift from the surface of the substrate;
- cutting the bond wire;
- and
- forming a first wirebond on the surface of the substrate using the bond head.
3 more elements
Dependencies are inferred from the claim text.