H10W 72/07527
Involving guiding structures
Official title: {involving guiding structures, e.g. spacers or supporting members}
H10W72/07527 (Involving guiding structures) appears on 23 US grants and 26 published applications in this corpus.
Search patents in H10W- Granted patents
- 23
- Published applications
- 26
- Assignees
- 16
- Inventors
- 43
- Latest grant
- 21 Nov 2023
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2003 | 0 | 1 |
| 2004 | 0 | 0 |
| 2005 | 0 | 1 |
| 2006 | 0 | 2 |
| 2007 | 2 | 0 |
| 2008 | 2 | 1 |
| 2009 | 0 | 1 |
| 2010 | 1 | 2 |
| 2011 | 1 | 2 |
| 2012 | 1 | 3 |
| 2013 | 2 | 1 |
| 2014 | 2 | 1 |
| 2015 | 2 | 2 |
| 2016 | 1 | 1 |
| 2017 | 1 | 1 |
| 2018 | 2 | 1 |
| 2019 | 2 | 2 |
| 2020 | 1 | 1 |
| 2021 | 1 | 0 |
| 2022 | 1 | 1 |
| 2023 | 1 | 0 |
| 2024 | 0 | 0 |
| 2025 | 0 | 1 |
| 2026 | 0 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- System for inserting a wire into a semiconductor chip21 Nov 2023US 11,822,309 B2Primo1D
- Die bonding material, light-emitting device, and method for producing light-emitting device26 Apr 2022US 11,315,899 B2Lintec Corporation
- Method for inserting a wire into a groove of a semiconductor chip28 Dec 2021US 11,209,799 B2Primo1D
- Wire bond clamp design and lead frame capable of engaging with same8 Dec 2020US 10,861,777 B2Texas Instruments Incorporated
- Method of manufacturing a semiconductor device3 Sep 2019US 10,403,616 B2Fuji Electric Co., Ltd.
- Semiconductor package29 Jan 2026US 2026/0033354 A1Samsung Electronics Co., Ltd.
- Wire Bonding Method and Apparatus20 Mar 2025US 2025/0096195 A1
- Method for inserting a wire into a groove of a semiconductor chip3 Mar 2022US 2022/0066416 A1Primo1D
- Die bonding material, light-emitting device, and method for producing light-emitting device22 Oct 2020US 2020/0335471 A1Lintec Corporation
- Method for inserting a wire into a groove of a semiconductor chip, and piece of equipment for implementing such a method26 Dec 2019US 2019/0391560 A1Primo1D
Most cited
By later US patents
- Apparatus, system, and method for wireless connection in integrated circuit packages111US 8,084,867 B2Intel Corporation · 2011
- Semiconductor integrated circuit package having electrically disconnected solder balls for mounting13US 7,276,802 B2Micron Technology, Inc. · 2007
- Semiconductor integrated circuit package having electrically disconnected solder balls for mounting11US 7,268,067 B2Micron Technology, Inc. · 2007
- Multi-chip package and method of manufacturing thereof7US 8,362,624 B2Samsung Electronics Co., Ltd. · 2013
- Apparatus, system, and method for wireless connection in integrated circuit packages4US 8,513,108 B2Intel Corporation · 2013