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US 8,513,108 B2Granted
Apparatus, system, and method for wireless connection in integrated circuit packages
AssigneeIntel Corporation
InventorsJiamiao Tang, Henry Xu, Shinichi Sakamoto
Life of this patent
Estimating the term…
Abstract
Some embodiments of the invention include a connecting structure between a support and at least one die attached to the support. The die includes a number of die bond pads on a surface of the die. The connecting structure includes a plurality of via and groove combinations. Conductive material is formed in the via and groove combinations to provide connection between the die bond pads and bond pads on the support. Other embodiments are described and claimed.
Claims20
A method comprising:
- forming a dielectric layer over at least one die and over a portion of a support attached to the die;
- forming a plurality of via and groove combinations in the dielectric layer, wherein each of the via and groove combinations provides an access to a plurality of die bond pads on the die and an access to a plurality of support bond pads on the support;
- and
- forming a plurality of connections in the via and groove combinations including forming a conductive segment inside a groove of the groove and via combination, such that the conductive segment is unparallel to a surface of the support and at an angle relative to the surface of the support, wherein each of the connections is coupled to one of the die bond pads and one of the support bond pads.
1 more element
A method comprising:
- forming a dielectric over a first bond pad and a second bond pad, the first bond pad located on a first die, the second bond pad located on a second die;
- forming a first via in the dielectric, the first via providing access to the first bond pad;
- forming a second via in the dielectric, the second via providing access to the second bond pad;
- forming a groove bridging the first and second vias;
- and
- forming a connection in the groove and the vias to couple to the first bond pad to the second bond pad through the connection, wherein forming the connection includes forming a conductive segment inside the groove, such that the conductive segment is unparallel to a surface of a support supporting the first die and at an angle relative to the surface of the support.
3 more elements
Dependencies are inferred from the claim text.