System for inserting a wire into a semiconductor chip

A system for fastening at least one wire to at least one semiconductor chip, comprising:

• a wire supply positioning member located and configured to supply the at least one wire to a workspace;
• a storage positioning member located and configured to receive the at least one wire after the at least one wire has passed from the wire supply positioning member, through the workspace, and to the storage positioning member;
• a handling device located and configured to handle the at least one semiconductor chip within the workspace, the handling device located and configured to place the at least one semiconductor chip at a location within the workspace;
• a movable abutment member located and configured to press a longitudinal section of the at least one wire along a groove and in forced abutment against at least one pad of the at least one semiconductor ship;
• and
• a heating member located and configured to heat at least a zone of the workspace in which the at least one pad of the at least one semiconductor ship pad is located when the chip is placed in an insertion position within the workspace by the handling device.