Method for inserting a wire into a groove of a semiconductor chip, and piece of equipment for implementing such a method

A system for inserting a wire into at least one chip, the chip having a groove for receiving a longitudinal section of the wire and the groove containing a pad made of a bonding material having a melting point, the piece of equipment comprising:

• positioning members for deploying and moving a length of the wire between a first end and a second end of a workspace;
• a handling device for handling the chip, the handling device capable of placing the chip in an insertion position in which the groove is placed opposite the wire;
• a positioning member for arranging the longitudinal section of the wire along the groove, in forced abutment against the pad;
• and
• a heating member for heating a zone comprising the pad to a processing temperature when the chip is placed in the insertion position.