Method of manufacturing a semiconductor device

A method of manufacturing a semiconductor device that includes an insulated circuit board having a conductive pattern, a first semiconductor chip with a rectangular shape having first to fourth corner portions, connected through a first joining material to the conductive pattern, a second semiconductor chip with a rectangular shape having first to fourth corner portions, disposed on the conductive pattern separated from the first semiconductor chip and connected through a second joining material to the conductive pattern, a terminal disposed above the first semiconductor chip and the second semiconductor chip to connect the first semiconductor chip to the second semiconductor chip, connected to the first semiconductor chip through a third joining material, and connected to the second semiconductor chip through a fourth joining material,

• the method comprising
• (a) determining a position of the first semiconductor chip using the four corner portions thereof and a position of the second semiconductor chip using the four corner portions thereof, a side face between the third corner portion and the fourth corner portion of the first semiconductor chip facing a side face between the third corner portion and the fourth corner portion of the second semiconductor chip;
• (b) performing a reflow process for connecting the first semiconductor chip by the first joining material to the conductive pattern, and the second semiconductor chip by the second joining material to the conductive pattern, wherein
• the first and second corner portions of the first semiconductor chip which are the farthest corner portions from the second semiconductor chip, and the first and second corner portions of the second semiconductor chip which are the farthest corner portions from the first semiconductor chip, are positioned with a first positioning member to determine the positions of the first and second semiconductor chips, the first position member providing outermost boundaries for the first and second corner portions of the first and second semiconductor chips during the connecting process and
• the third corner portion of the first semiconductor chip and the third corner portion of the second semiconductor chip are the closest corner portions to each other, and are positioned with a second positioning member that is inserted into a first through-hole formed in the terminal at a position between the third corner portions of the first and second semiconductor chips in a plan view of the semiconductor device, the second positioning member providing outermost boundaries for the third corner portions of the first and second semiconductor chips during the connecting process.