Method for inserting a wire into a groove of a semiconductor chip

A system for fastening at least one wire to at least one semiconductor chip, comprising:

• a wire supply member for supplying the at least one wire to a workspace;
• a storage member for receiving the at least one wire after it has passed from the wire supply member, through the workspace, and to the storage member;
• a handling device for handling the at least one semiconductor chip, the handling device located and configured to place the at least one semiconductor chip at a location within the workspace;
• a movable positioning member located and configured to press a longitudinal section of the at least one wire along a groove and in forced abutment against at least one pad of the at least one semiconductor ship;
• and
• a heating member located and configured to heat at least a zone of the workspace in which the at least one pad of the at least one semiconductor ship pad is located when the chip is placed in an insertion position within the workspace by the handling device.