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US 8,084,867 B2Granted
Apparatus, system, and method for wireless connection in integrated circuit packages
AssigneeIntel Corporation
InventorsJiamiao Tang, Henry Xu, Shinichi Sakamoto
Life of this patent
Estimating the term…
Abstract
Some embodiments of the invention include a connecting structure between a support and at least one die attached to the support. The die includes a number of die bond pads on a surface of the die. The connecting structure includes a plurality of via and groove combinations. Conductive material is formed in the via and groove combinations to provide connection between the die bond pads and bond pads on the support. Other embodiments are described and claimed.
Claims14
An apparatus comprising:
- a support including a support surface and a support bond pad on the support surface;
- a first die including a die surface and a die bond pad on the die surface;
- a dielectric layer located outside the first die, the dielectric layer including a via and groove combination coupled to the die bond pad and the support bond pad;
- and
- a connection coupled to the die bond pad and the support bond pad, wherein the connection includes a conductive segment inside a groove of the via and groove combination, and the conductive segment is unparallel to the support surface such that the conductive segment is at an angle relative to the support surface.
2 more elements
A system comprising:
- an integrated circuit package including:
- a support including a support surface and a support bond pad on the support surface;
- a first die including a die surface and a die bond pad on the die surface;
- a dielectric layer located outside the die, the die electric layer including a via and groove combination coupled to the die bond pad and the support bond pad;
- and
- a connection coupled to the die bond pad and the support bond pad, wherein connection includes a conductive segment inside a groove of the via and groove combination, and the conductive segment is unparallel to the support surface such that the conductive segment is at an angle relative to the support surface;
- and
- a dynamic random access memory device coupled to the support bond pad.
5 more elements
Dependencies are inferred from the claim text.