Die bonding material, light-emitting device, and method for producing light-emitting device

A die bonding material comprising the following component (A) and a solvent, and having a refractive index (nD) at 25° C. of 1.41 to 1.43 and a thixotropic index of 2 or more,

• Component (A):
• a curable polysilsesquioxane compound having a repeating unit represented by the following formula (a-1) and satisfying the following requirement 1 and requirement 2,
• R1-D-SiO3/2 (a-1)
• [wherein R1 represents a fluoroalkyl group represented by a compositional formula:
• CmH(2m−n+1)Fn;
• m represents an integer of 1 to 10, and n represents an integer of 2 to (2m+1);
• and D represents a linking group (excluding an alkylene group) for connecting R1 and Si, or a single bond],
• [Requirement 1]
• as a result of measuring a 29Si-NMR of the curable polysilsesquioxane compound, one or two or more peaks are observed in a region [region (2)] of −62 ppm or more and less than −52 ppm, one or two or more peaks are observed in at least one region of a region [region (1)] of −52 ppm or more and less than −45 ppm and a region [region (3)] of −73 ppm or more and less than −62 ppm, and Z2 determined by the following formula is 20% to 40%,
• Z
• ⁢
• ⁢
• 2
• =
• P
• ⁢
• ⁢
• 2
• P
• ⁢
• ⁢
• 1
• +
• P
• ⁢
• ⁢
• 2
• +
• P
• ⁢
• ⁢
• 3
• ×
• 100
• P1:
• an integrated value in the region (1)
• P2:
• an integrated value in the region (2)
• P3:
• an integrated value in the region (3)
• [Requirement 2]
• the curable polysilsesquioxane compound has a mass average molecular weight (Mw) of 4,000 to 11,000.