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US 10,861,777 B2Granted
Wire bond clamp design and lead frame capable of engaging with same
AssigneeTexas Instruments Incorporated
InventorsYuh-Harng Chien, Hung-Yu Chou, Fu-Kang Lee
Life of this patent
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Abstract
Aspects of the disclosure relate generally to semiconductor packaging, and specifically to semiconductor device having a lead frame having a semiconductor supporting die pad that is capable of engaging with a wire bonding clamp.
Claims13
A semiconductor device comprising:
- a first die supporting pad including a first extension, a second extension, and a third extension from the first die supporting pad;
- a second die supporting pad a fourth extension from the second die supporting pad;
- and
- a first semiconductor die attached to the first die supporting pad, and a second semiconductor die attached to the second die supporting pad, the first semiconductor die and the second semiconductor die electrically connected to at least some leads of a plurality of leads of the semiconductor device, the first semiconductor die electrically connected to the second semiconductor die;
- wherein:
- the first extension, and the second extension are parallel to each other from a top view of the semiconductor device;
- the third extension includes a wire bond attached thereto;
- and
- the fourth extension extends from two adjacent sides at an angle substantially perpendicular to each of the two adjacent sides of the second die supporting pad.
6 more elements
A semiconductor device comprising:
- a first die supporting pad including a first extension, a second extension, and a third extension from the first die supporting pad;
- a second die supporting pad a fourth extension from the second die supporting pad;
- and
- a first semiconductor die attached to the first die supporting pad, and a second semiconductor die attached to the second die supporting pad, the first semiconductor die and the second semiconductor die electrically connected to at least some leads of a plurality of leads of the semiconductor device, the first semiconductor die electrically connected to the second semiconductor die;
- wherein the first extension, and the second extension extend in opposite directions parallel to each other from a top view of the semiconductor device, and wherein each of the third extension and the fourth extension includes a cavity.
2 more elements
Dependencies are inferred from the claim text.