H10W 72/07531
Techniques
Official title: {Techniques}
H10W72/07531 (Techniques) appears on 3,163 US grants and 2,744 published applications in this corpus.
Search patents in H10W- Granted patents
- 3,163
- Published applications
- 2,744
- Assignees
- 717
- Inventors
- 4,894
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 11 | 0 |
| 1977 | 14 | 0 |
| 1978 | 7 | 0 |
| 1979 | 5 | 0 |
| 1980 | 7 | 0 |
| 1981 | 2 | 0 |
| 1982 | 10 | 0 |
| 1983 | 10 | 0 |
| 1984 | 17 | 0 |
| 1985 | 11 | 0 |
| 1986 | 20 | 0 |
| 1987 | 11 | 0 |
| 1988 | 19 | 0 |
| 1989 | 24 | 0 |
| 1990 | 23 | 0 |
| 1991 | 39 | 0 |
| 1992 | 43 | 0 |
| 1993 | 47 | 0 |
| 1994 | 51 | 0 |
| 1995 | 47 | 0 |
| 1996 | 48 | 0 |
| 1997 | 61 | 0 |
| 1998 | 64 | 0 |
| 1999 | 97 | 0 |
| 2000 | 91 | 0 |
| 2001 | 123 | 64 |
| 2002 | 111 | 109 |
| 2003 | 98 | 139 |
| 2004 | 86 | 101 |
| 2005 | 87 | 151 |
| 2006 | 113 | 116 |
| 2007 | 78 | 124 |
| 2008 | 80 | 151 |
| 2009 | 87 | 134 |
| 2010 | 113 | 192 |
| 2011 | 134 | 169 |
| 2012 | 155 | 134 |
| 2013 | 136 | 111 |
| 2014 | 121 | 123 |
| 2015 | 114 | 142 |
| 2016 | 117 | 97 |
| 2017 | 87 | 88 |
| 2018 | 95 | 93 |
| 2019 | 64 | 77 |
| 2020 | 74 | 85 |
| 2021 | 61 | 79 |
| 2022 | 60 | 89 |
| 2023 | 59 | 52 |
| 2024 | 57 | 48 |
| 2025 | 42 | 43 |
| 2026 | 32 | 33 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Bondable pillars for wire bonds in a semiconductor package6 Oct 2026US 12,757,414 B2Micron Technology, Inc.
- Bonding wire for semiconductor devices8 Sep 2026US 12,733,530 B2Nippon Micrometal Corporation
- Bonding tool, semiconductor device manufacturing method, and semiconductor device1 Sep 2026US 12,727,501 B2Fuji Electric Co., Ltd.
- Bonding wire for semiconductor devices25 Aug 2026US 12,721,208 B2Nippon Micrometal Corporation
- Silicon carbide device and method for forming a silicon carbide device11 Aug 2026US 12,707,957 B2Infineon Technologies AG
- Semiconductor Device and Method of Making a Semiconductor Package with Graphene for Die Attach1 Oct 2026US 2026/0305028 A1STATS ChipPAC Pte. Ltd.
- Microelectronic device package with open cavity1 Oct 2026US 2026/0305456 A1Texas Instruments Incorporated
- Integrated electrical and optical interposer for interconnection of multiple electronic and photonic chips3 Sep 2026US 2026/0262551 A1Psiquantum, Corp.
- Automatic wire threading method and system27 Aug 2026US 2026/0250097 A1Asmpt Singapore Pte. Ltd.
- Capillary head with noncircular cone for wirebonding in semiconductor package manufacturing27 Aug 2026US 2026/0256014 A1
Most cited
By later US patents
- Semiconductor device475US 6,316,838 B1Fujitsu Limited · 2001
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Three dimensional high performance interconnection package422US 5,371,654 AInternational Business Machines Corporation · 1994
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999