H10W 72/07536
Soldering or alloying
Official title: {Soldering or alloying}
H10W72/07536 (Soldering or alloying) appears on 174 US grants and 198 published applications in this corpus.
Search patents in H10W- Granted patents
- 174
- Published applications
- 198
- Assignees
- 104
- Inventors
- 480
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 3 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 5 |
| 2003 | 3 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 3 |
| 2006 | 1 | 2 |
| 2007 | 3 | 3 |
| 2008 | 2 | 2 |
| 2009 | 3 | 0 |
| 2010 | 0 | 5 |
| 2011 | 4 | 4 |
| 2012 | 5 | 4 |
| 2013 | 4 | 6 |
| 2014 | 8 | 18 |
| 2015 | 16 | 30 |
| 2016 | 19 | 12 |
| 2017 | 14 | 15 |
| 2018 | 12 | 11 |
| 2019 | 14 | 12 |
| 2020 | 6 | 13 |
| 2021 | 10 | 12 |
| 2022 | 6 | 9 |
| 2023 | 8 | 8 |
| 2024 | 12 | 10 |
| 2025 | 4 | 9 |
| 2026 | 5 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Bondable pillars for wire bonds in a semiconductor package6 Oct 2026US 12,757,414 B2Micron Technology, Inc.
- Chip package structure and method for producing the same7 Apr 2026US 12,598,821 B2Tong Hsing Electronic Industries, Ltd.
- Chip packaging method involving fabrication of wire bond and electroplated metal bonding pad through formation of metal gasket, passivation layer, metal seed layer, and photoresist7 Apr 2026US 12,599,025 B2Chipmore Technology Corporation Limited
- Semiconductor module comprising a semiconductor and comprising a shaped metal body that is electrically contacted by the semiconductor17 Mar 2026US 12,581,983 B2Danfoss Silicon Power GmbH
- Integrated circuit packages to minimize stress on a semiconductor die27 Jan 2026US 12,538,804 B2Analog Devices International Unlimited Company
- Integrated electrical and optical interposer for interconnection of multiple electronic and photonic chips3 Sep 2026US 2026/0262551 A1Psiquantum, Corp.
- Wire post bump forming process23 Jul 2026US 2026/0215313 A1Texas Instruments Incorporated
- Bga electronic device with gull wing leads25 Jun 2026US 2026/0182407 A1
- Hybrid-material leads for solderless coupling of an electronic component28 May 2026US 2026/0150713 A1Semiconductor Components Industries, LLC
- Coaxial wire assemblies for semiconductor packages28 May 2026US 2026/0150745 A1SanDisk Technologies LLC
Most cited
By later US patents
- Electronic component and method of manufacture123US 6,164,523 ASemiconductor Components Industries, LLC · 2000
- Apparatus, system, and method for wireless connection in integrated circuit packages111US 8,084,867 B2Intel Corporation · 2011
- Flexible substrate mounted solid-state light sources for exterior vehicular lighting101US 6,520,669 B1Light Sciences Corporation · 2003
- Thin chip-size integrated circuit package71US 6,091,140 ATexas Instruments Incorporated · 2000
- Method of connecting semiconductor structure to external circuits61US 4,176,443 ASGS-ATES Componenti Elettronici S.p.A. · 1979