Chip package structure and method for producing the same

A method for producing a chip package structure, at least comprising:

• providing a substrate;
• forming a mirror ink on the substrate;
• providing a chip and placing the chip upside-down on the substrate;
• forming a plurality of soldering wires coupled with a plurality of conduct portions of the chip and a plurality of pads of the substrate;
• forming a support body on an upper surface of the substrate;
• providing a package cover adhered to a top surface of the support body;
• performing a solidifying process in which a solidifying light beam is emitted to the mirror ink and the mirror ink is utilized to reflect the solidifying light beam to the support body to solidify the support body;
• performing a packaging process in which a package layer is formed to cover the chip, an outer periphery of the support body, and the package cover, and the package layer does not completely cover an exposed surface of the package cover;
• and
• performing a cutting process in which the package layer and the substrate are cut along the mirror ink to form a chip package structure.