Coaxial wire assemblies for semiconductor packages

A coaxial wire assembly extending between a contact pad of a substrate and a die contact pad of a die included in a semiconductor package, the coaxial wire assembly comprising:

• a bond wire contacting and extending between the contact pad and the die contact pad;
• a dielectric material layer surrounding the bond wire;
• and
• a ground material layer surrounding the dielectric material layer.

A semiconductor package, comprising:

• a substrate, including:
• a first contact means;
• and
• a ground means formed adjacent the first contact means;
• a die positioned over the substrate, adjacent the first contact means, the die including:
• a top surface;
• and
• a second contact mean formed on the top surface;
• and
• a coaxial wire assembly extending between the first contact means and the second contact means, the coaxial wire assembly including:
• an electrical bonding means contacting and extending between the first contact means and the second contact means;
• an insulative means surrounding the electrical bonding means;
• and
• a conductive means surrounding the insulative means.