Bga electronic device with gull wing leads
OwnerFrancis Glyde Medina, Von Mendoza +1inventors
InventorsFrancis Glyde Medina, Von Mendoza, Jovenic Esquejo
Life of this patent
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Abstract
An electronic device includes: a substrate having opposite first and second sides, a first conductive feature on the first side, and a second conductive feature on the second side; a semiconductor die attached to the first side of the substrate; a lead coupled to the first conductive feature and extending outward from a lateral side of the electronic device; and a solder ball coupled to the second conductive feature of the substrate and extending outward from the second side of the substrate.
Claims20
An electronic device, comprising:
- a substrate having opposite first and second sides, a first conductive feature on the first side, and a second conductive feature on the second side;
- a semiconductor die attached to the first side of the substrate;
- a lead coupled to the first conductive feature and extending outward from a lateral side of the electronic device;
- and
- a solder ball coupled to the second conductive feature of the substrate and extending outward from the second side of the substrate.
A system, comprising:
- a circuit board having a first conductive pad and a second conductive pad;
- and
- an electronic device, including:
- a substrate having opposite first and second sides, a first conductive feature on the first side, and a second conductive feature on the second side;
- a semiconductor die attached to the first side of the substrate;
- a lead coupled to the first conductive feature and extending outward from a lateral side of the electronic device, the lead soldered to the first conductive pad of the circuit board;
- and
- a solder ball coupled to the second conductive feature of the substrate and extending outward from the second side of the substrate, the solder ball soldered to the second conductive feature of the circuit board.
A method of fabricating an electronic device, the method comprising:
- attaching a first side of a substrate to a prospective lead of a lead frame;
- attaching a semiconductor die to the first side of the substrate;
- trimming and forming the prospective lead of the lead frame;
- and
- attaching a solder ball to a second side of the substrate.
Dependencies are inferred from the claim text.