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US 6,164,523 AGranted
Electronic component and method of manufacture
AssigneeSemiconductor Components Industries, LLC
InventorsJoseph K. Fauty, James P. Letterman, Jr., Michael J. Seddon
Life of this patent
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Abstract
A method of manufacturing an electronic component includes providing a substrate (101), forming a semiconductor device in the substrate (101), depositing a metal layer (107) over the substrate (101) and electrically coupled to the semiconductor device, depositing a layer (108) of solder over the metal layer, and wire bonding a wire (109) to the metal layer (107).
Claims9
A method of manufacturing an electronic component comprising:
- providing a silicon substrate having a metal layer over the substrate;
- depositing a solderable metal layer over the metal layer;
- and
- bonding initially only a first end of a wire to the solderable metal layer.
1 more element
Dependencies are inferred from the claim text.