H10W 72/07535
Applying em radiation
Official title: {Applying EM radiation, e.g. induction heating or using a laser}
H10W72/07535 (Applying em radiation) appears on 82 US grants and 74 published applications in this corpus.
Search patents in H10W- Granted patents
- 82
- Published applications
- 74
- Assignees
- 52
- Inventors
- 218
- Latest grant
- 16 Jul 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 4 | 0 |
| 1995 | 2 | 0 |
| 1996 | 4 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 0 |
| 2002 | 4 | 1 |
| 2003 | 1 | 3 |
| 2004 | 3 | 3 |
| 2005 | 1 | 3 |
| 2006 | 3 | 2 |
| 2007 | 1 | 2 |
| 2008 | 2 | 4 |
| 2009 | 2 | 5 |
| 2010 | 2 | 8 |
| 2011 | 2 | 2 |
| 2012 | 3 | 2 |
| 2013 | 4 | 3 |
| 2014 | 3 | 4 |
| 2015 | 5 | 2 |
| 2016 | 1 | 2 |
| 2017 | 2 | 3 |
| 2018 | 3 | 3 |
| 2019 | 1 | 3 |
| 2020 | 2 | 3 |
| 2021 | 2 | 5 |
| 2022 | 5 | 3 |
| 2023 | 1 | 3 |
| 2024 | 2 | 0 |
| 2025 | 0 | 4 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Selective soldering with photonic soldering technology16 Jul 2024US 12,041,728 B2Apple Inc.
- Semiconductor device and method for fabricating the same2 Jul 2024US 12,027,490 B2Infineon Technologies AG
- High density and durable semiconductor device interconnect12 Sep 2023US 11,756,923 B2Infineon Technologies AG
- Power semiconductor package with highly reliable chip topside27 Dec 2022US 11,538,734 B2Hitachi Energy Switzerland AG
- Die carrier package and method of forming same15 Nov 2022US 11,502,009 B2Medtronic, Inc.
- Layer ribbon construction for laser ribbon bonding process25 Jun 2026US 2026/0175039 A1Cardiac Pacemakers, Inc.
- Semiconductor package18 Dec 2025US 2025/0385214 A1Samsung Electronics Co., Ltd.
- Electronic modules having electrical connection elements in the form of wedge-wedge-bonded structures not consisting of solid metal material3 Jul 2025US 2025/0219008 A1Heraeus Electronics GmbH & Co. KG
- Laser enhanced wire bonding for semiconductor device packages1 May 2025US 2025/0140739 A1Texas Instruments Incorporated
- Semiconductor arrangement comprising a semiconductor element with at least one connection element10 Apr 2025US 2025/0118633 A1Siemens Aktiengesellschaft
Most cited
By later US patents
- Three dimensional high performance interconnection package422US 5,371,654 AInternational Business Machines Corporation · 1994
- Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof284US 5,821,763 AInternational Business Machines Corporation · 1998
- Method of forming a three dimensional high performance interconnection package271US 5,531,022 AInternational Business Machines Corporation · 1996
- Test probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformer256US 5,635,846 AInternational Business Machines Corporation · 1997
- High density integrated circuit apparatus, test probe and methods of use thereof207US 6,334,247 B12002