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US 12,041,728 B2Granted
Selective soldering with photonic soldering technology
AssigneeApple Inc.
InventorsMaryam Rahimi, Meng Chi Lee, Wyeman Chen, Leilei Zhang, Jason P. Marsh, Lan Hoang, Yashar Abdollahian
Life of this patent
Estimating the term…
Abstract
Electronic assembly methods and structures are described. In an embodiment, an electronic assembly method includes bringing together an electronic component and a routing substrate, and directing a large area photonic soldering light pulse toward the electronic component to bond the electronic component to the routing substrate.
Claims20
An electronic assembly comprising:
- a routing substrate including a top side and a bottom side, wherein the routing substrate includes a first compartment opening and a second compartment opening separated by a barrier wall;
- an electronic component including a plurality of via openings between a top side and a bottom side of the electronic component;
- a corresponding plurality of separate bonding material joints, wherein each bonding material joint is on the top side of the routing substrate and at least partially fills a corresponding via opening of the plurality of via openings;
- and
- a plurality of devices bonded to a bottom side of the electronic component, wherein a first group of the plurality of devices is partitioned from a second group of the plurality of devices by the barrier wall.
2 more elements
An electronic assembly comprising:
- a bottom rigid circuit board;
- a first plurality of devices bonded to a top side of the bottom rigid circuit board;
- an interposer bonded to the bottom rigid circuit board laterally adjacent to the first plurality of devices;
- wherein the interposer includes a first compartment opening and a second compartment opening separated by a barrier wall, wherein a first group of the first plurality of devices is partitioned from a second group of the first plurality of devices by the barrier wall;
- a top rigid circuit board bonded to the interposer with a plurality of bonding material joints, wherein the top rigid circuit board includes a plurality of via openings extending completely through the top rigid circuit board, and the plurality of bonding material joints at least partially fill the plurality of via openings.
2 more elements
Dependencies are inferred from the claim text.