US 5,821,763 A · Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof

Abstract

The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant of high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer. The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.

Claims13

Dependent claims

An electronic device probe for probing an electronic device comprising:

a first space transformer having a first surface;
said first surface having a first plurality of contact locations;
a first plurality of elongated electrical conductors each having a protuberance at one end thereof;
said protuberance of each of said plurality of elongated conductors is wire bonded to one of said plurality of contact locations forming a bond to said one of said plurality of contact locations, each of said bond has flattened spherelike shape;
each of said plurality of elongated conductors extends outwardly away from said surface to form an array of elongated conductors;
said array of elongated conductors being embedded in a material;
and
said elongated conductors having exposed probe tip ends at an exposed surface of said material.

5 more elements

An electronic device probe for probing an electronic device comprising:

a first space transformer having a surface;
said surface having a first plurality of contact locations;
a plurality of elongated electrical conductors each having a protuberance at a first end thereof, each of said plurality of elongated conductors has a second end,
said each of said protuberance of each of said plurality of elongated conductors is bonded to one of said plurality of contact locations;
each of said plurality of elongated conductors extends outwardly away from said surface to form an array of elongated conductors;
said array of elongated conductors being embedded in an elastomeric material;
said elongated conductors being embedded in an elastomeric material;
a second space transformer in electrical connection with said first space transformer;
said first space transformer has a second surface with a second plurality of contact locations thereon and said second space transformer has a surface with a plurality of third contact locations thereon;
an electrical interconnection means for electrically interconnecting said second plurality of electrical contact locations to said third plurality of electrical contact locations;
a holding means for holding said first space transformer in a fixed spatial relationship with respect to said second space transformer;
and
a means for disposing said second ends in electrical contact with contact location on said electronic device.

10 more elements

Dependencies are inferred from the claim text.

Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof

Life of this patent

Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof

Life of this patent

Abstract

Claims13