Die carrier package and method of forming same

A method comprising:

• disposing a die carrier package on a first major surface of device substrate, wherein the package comprises:
• a die that comprises an active surface facing the device substrate, wherein the die is adapted to emit light through the first and second major surfaces of the device substrate, wherein the die is disposed within a cavity of a carrier substrate of the package, wherein the die further comprises a first die contact disposed on the active surface of the die and a second die contact disposed on a major surface of the die that faces a recessed surface of the cavity of the die carrier package and that is opposed to the active surface, wherein the first die contact is electrically connected to a first package contact disposed on a first major surface of the carrier substrate of the package adjacent the cavity and the second die contact is electrically connected to a second package contact disposed on the first major surface of the carrier substrate of the package adjacent the cavity, wherein the first and second package contacts are disposed between the first major surface of the carrier substrate and the first and second major surfaces of the device substrate;
• and
• disposing a detector on the first major surface of the device substrate, wherein the detector is adapted to detect at least a portion of the light emitted by the die.

A method comprising:

• forming cavities in a first major surface of a carrier substrate wafer that comprises a plurality of carrier substrates, wherein the first major surface of the carrier substrate wafer forms a first major surface of each carrier substrate, wherein each cavity comprises a recessed surface;
• forming a patterned conductive layer on the recessed surface of each cavity and the first major surface of the carrier substrate wafer, wherein the first patterned conductive layer comprises first and second package contacts disposed on the first major surface of each carrier substrate adjacent the cavity and first and second die pads disposed on the recessed surface of the cavity, wherein the first package contact is electrically connected to the first die pad by a first conductor and the second package contact is electrically connected to the second die pad by a second conductor;
• disposing a die within each cavity, wherein each die is adapted to emit electromagnetic radiation from an active surface of the die;
• electrically connecting a first die contact of each die to the first die pad of the patterned conductive layer of each carrier substrate, wherein the first die contact is disposed on the active surface of the die;
• and
• electrically connecting a second die contact of each die to the second die pad of the patterned conductive layer of each carrier substrate, wherein the second die contact is disposed on a major surface of the die that faces the recessed surface and is opposed to the active surface;
• wherein the first and second conductors of the patterned conductive layer of each carrier substrate extend between the recessed surface of the cavity and the first major surface of the carrier substrate adjacent the cavity.