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US 2025/0140739 A1Published application
Laser enhanced wire bonding for semiconductor device packages
AssigneeTexas Instruments Incorporated
InventorsKashyap Mohan, Daiki Komatsu, Amin Ahmad Sijelmassi
Life of this patent
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Abstract
An example apparatus includes: a wire bond tool including a bond wire capillary having a central opening configured for receiving a bond wire in the central opening; a first laser path formed in the capillary configured to focus a first laser beam on the end of the bond wire to form a free air ball; and a second laser path formed in the capillary configured to focus a second laser beam on a bonding location beneath the capillary.
Claims28
A method, comprising:
- using a first laser, forming a free air ball of molten material on an end of a bond wire extending through a capillary;
- using a second laser, forming a molten area on a bond pad of semiconductor die at a bonding location;
- moving the capillary and contacting the molten area with the free air ball;
- forming a ball bond between the free air ball and the molten area of the bond pad;
- moving the capillary away from the ball bond, while allowing the bond wire to extend from the ball bond and forming a wire bond loop in the bond wire extending from the ball bond;
- moving the capillary and extending the bond wire above a stitch bond location on a lead of a package substrate the semiconductor die is mounted on;
- using the second laser, forming a molten area in a heat affected zone on the lead at the stitch bond location;
- and
- using the capillary, contacting the molten area in the heat affected zone on the lead with the bond wire and while using the first laser to heat the bond wire, forming a stitch bond between the bond wire and the molten area on the lead.
6 more elements
An apparatus, comprising:
- a leadframe having a die pad and leads spaced from the die pad;
- a semiconductor die mounted to the die pad, and having bond pads facing away from the leadframe;
- a wire bond electrically coupling the bond pad to a lead, the wire bond comprising:
- a ball bond formed on the bond pad, the ball bond having a metal-to-metal bond between the ball and the bond pad, the bond pad having a first heat affected zone beneath the ball bond of less than 100 microns in diameter;
- a bond wire extending from the ball bond;
- a stitch bond formed on the lead between the lead and the bond wire, the stitch bond being a metal-to-metal bond having a second heat affected zone on the lead of less than 100 microns in diameter;
- and
- mold compound covering the semiconductor die, the wire bond, and a portion of the leads of the leadframe to form a semiconductor device package.
5 more elements
A wire bond tool, comprising:
- a capillary having a central opening configured for receiving a bond wire in the central opening;
- a first laser path formed in the capillary configured to focus a first laser beam on the end of the bond wire when it extends from the opening;
- and
- a second laser path formed in the capillary configured to focus a second laser beam on a bonding location beneath the capillary.
1 more element
Dependencies are inferred from the claim text.