H10W 72/07537
Using a polymer adhesive
Official title: {using a polymer adhesive, e.g. an adhesive based on silicone or epoxy}
H10W72/07537 (Using a polymer adhesive) appears on 36 US grants and 49 published applications in this corpus.
Search patents in H10W- Granted patents
- 36
- Published applications
- 49
- Assignees
- 38
- Inventors
- 113
- Latest grant
- 16 Jul 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 1 | 1 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 1 | 1 |
| 2008 | 0 | 2 |
| 2009 | 1 | 0 |
| 2010 | 1 | 5 |
| 2011 | 1 | 4 |
| 2012 | 5 | 2 |
| 2013 | 3 | 2 |
| 2014 | 2 | 1 |
| 2015 | 1 | 5 |
| 2016 | 4 | 2 |
| 2017 | 1 | 4 |
| 2018 | 3 | 2 |
| 2019 | 1 | 3 |
| 2020 | 0 | 1 |
| 2021 | 3 | 6 |
| 2022 | 2 | 1 |
| 2023 | 3 | 1 |
| 2024 | 1 | 1 |
| 2025 | 0 | 4 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Method for producing a semiconductor assembly comprising a semiconductor element and a substrate, and corresponding device25 Dec 2025US 2025/0391803 A1Siemens Aktiengesellschaft
- Multiple integrated circuit chip/module embedding by underfilling and direct print additive manufacturing30 Oct 2025US 2025/0336879 A1University of South Florida
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Most cited
By later US patents
- Flexible substrate mounted solid-state light sources for exterior vehicular lighting101US 6,520,669 B1Light Sciences Corporation · 2003
- Lead frames having a chromium and zinc alloy coating40US 5,343,073 AOlin Corporation · 1994
- Lead frames with improved adhesion to a polymer33US 5,449,951 AOlin Corporation · 1995
- Method for producing a set of chips mechanically interconnected by means of a flexible connection14US 8,258,011 B2Commissariat A L' Energie Atomique · 2012
- Assembly of radiofrequency chips14US 8,471,773 B2Commissariat A L' Energie Atomique · 2013