Packaged electronic device with split die pad in robust package substrate

A method, comprising:

• mounting at least one semiconductor die on a package substrate having at least one split die pad that comprises a slot separating a die mount portion from a wire bonding portion, the wire bonding portion directly attached and physically connected to the die mount portion at a first end of the slot;
• coupling a first lead of the package substrate to the wire bonding portion at a second end of the slot opposite the first end of the slot;
• forming a first wire bond between a first bond pad on the at least one semiconductor die and the wire bonding portion;
• forming a second wire bond between a second bond pad on the at least one semiconductor die and a signal lead on the package substrate;
• covering the at least one semiconductor die, the wire bonding portion, the die mount portion, the first and second wire bonds, and at least a portion of the signal lead and at least a portion of the first lead with mold compound, leaving a portion of the signal lead and the first lead not covered with mold compound;
• and
• removing an external frame from the package substrate to form a packaged semiconductor device.

A packaged electronic device, comprising:

• a package substrate with at least one split die pad including a slot between a die mount portion and a wire bonding portion having smaller area than the die mount portion;
• a first end of the wire bonding portion directly attached and physically connected to the die mount portion at one end of the slot;
• a second end of the wire bonding portion coupled to a first lead on the package substrate;
• at least one semiconductor die mounted on the die mount portion;
• a first end of a first wire bond bonded to a first bond pad on the at least one semiconductor die;
• a second end of the first wire bond bonded to the wire bonding portion;
• a first end of a second wire bond bonded to a second bond pad on the at least one semiconductor die;
• a second end of the second wire bond bonded to a signal lead on the package substrate;
• mold compound covering the at least one semiconductor die, the die mount portion, the wire bonding portion, and filling the slot;
• and
• the mold compound covering a portion of the signal lead and covering a portion of the first lead.