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US 8,258,011 B2Granted
Method for producing a set of chips mechanically interconnected by means of a flexible connection
AssigneeCommissariat a l'Energie Atomique
InventorsJean Brun, Bruno Mourey, Dominique Vicard
Life of this patent
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Abstract
The method relates to production of a set of chips mechanically interconnected by means of a flexible connection. The chips, integrated on a substrate, each comprise a receiving area. The chips of the set are connected in series in the receiving areas by a connecting element. The chips are then released, the connecting element forming a flexible connection.
Claims9
A method for producing an assembly of chips comprising:
- producing chips on a substrate, each chip comprising a groove,
- connecting the chips by embedding a flexible thread in the groove thereby forming the assembly of chips,
- releasing the chips, while maintaining the thread interconnected to the chips.
Dependencies are inferred from the claim text.