Enhanced cooling package for improved thermal management for electrical components

A method for of dissipating heat from an electrical component package, the method comprising:

• a. providing an electrical component having a top side and a bottom side;
• b. positioning the bottom side of the electrical component on a lead frame;
• c. providing a conductive clip having a first end and a second end,
• d. connecting the first end of a conductive clip to the top side of the electrical component and connecting the second end of the conductive clip to at least a first terminal lead;
• e. providing a second terminal lead positioned in the electrical component package;
• f. encapsulating the electrical component and conductive clip, and at least a portion of the first and second terminal leads with a packaging material;
• g. forming a recessed portion in a surface of the packaging material;
• and,
• h. forming a heat sink comprising a first planar portion extending from the lead frame, a second planar portion in spaced relation from the recessed portion of the mold defining a gap therebetween, and a fold portion extending between the first and second planar portions.