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AssigneeForm Factor, Inc.
InventorsThomas H. Dozier, II, Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu
Estimating the term…
Surface-mount, solder-down sockets permit electronic components such as semiconductor packages to be releasably mounted to a circuit board. Resilient contact structures extend from a top surface of a support substrate, and solder-ball (or other suitable) contact structures are disposed on a bottom surface of the support substrate. Composite interconnection elements are used as the resilient contact structures disposed atop the support substrate. In any suitable manner, selected ones of the resilient contact structures atop the support substrate are connected, via the support substrate, to corresponding ones of the contact structures on the bottom surface of the support substrate. In an embodiment intended to receive a LGA-type semiconductor package, pressure contact is made between the resilient contact structures and external connection points of the semiconductor package with a contact force which is generally normal to the top surface of the support substrate. In an embodiment intended to receive a BGA-type semiconductor package, pressure contact is made between the resilient contact structures and external connection points of the semiconductor package with a contact force which is generally parallel to the top surface of the support substrate.
Socket for releasably connecting a first electronic component to a second electronic component, comprising:
Socket, according to claim 23, further comprising:
Solder-down socket for releasably connecting an electronic component to a circuit board, comprising:
Socket for releasably connecting an electronic component to a circuit board, comprising:
Solder-down socket for making pressure connections from a plurality of terminals of a first electronic component to a second electronic component, comprising:
Method of removably connecting an electronic component to a circuit board, said circuit board having a plurality of contact areas on a surface thereof, said electronic component having a plurality of terminals, comprising:
Method of removably connecting an electronic component to a circuit board, said circuit board having a plurality of contact areas on a surface thereof, said electronic component having a plurality of terminals, comprising:
Dependencies are inferred from the claim text.