H10W 72/07532
Compression bonding
Official title: {Compression bonding, e.g. thermocompression bonding}
H10W72/07532 (Compression bonding) appears on 2,807 US grants and 2,398 published applications in this corpus.
Search patents in H10W- Granted patents
- 2,807
- Published applications
- 2,398
- Assignees
- 629
- Inventors
- 4,280
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 11 | 0 |
| 1977 | 14 | 0 |
| 1978 | 7 | 0 |
| 1979 | 4 | 0 |
| 1980 | 7 | 0 |
| 1981 | 2 | 0 |
| 1982 | 7 | 0 |
| 1983 | 10 | 0 |
| 1984 | 17 | 0 |
| 1985 | 10 | 0 |
| 1986 | 19 | 0 |
| 1987 | 8 | 0 |
| 1988 | 16 | 0 |
| 1989 | 20 | 0 |
| 1990 | 21 | 0 |
| 1991 | 37 | 0 |
| 1992 | 36 | 0 |
| 1993 | 42 | 0 |
| 1994 | 44 | 0 |
| 1995 | 38 | 0 |
| 1996 | 42 | 0 |
| 1997 | 49 | 0 |
| 1998 | 59 | 0 |
| 1999 | 92 | 0 |
| 2000 | 84 | 0 |
| 2001 | 117 | 63 |
| 2002 | 107 | 101 |
| 2003 | 91 | 132 |
| 2004 | 81 | 98 |
| 2005 | 87 | 146 |
| 2006 | 110 | 110 |
| 2007 | 74 | 119 |
| 2008 | 76 | 140 |
| 2009 | 80 | 124 |
| 2010 | 104 | 177 |
| 2011 | 126 | 156 |
| 2012 | 145 | 121 |
| 2013 | 120 | 98 |
| 2014 | 111 | 103 |
| 2015 | 96 | 114 |
| 2016 | 95 | 80 |
| 2017 | 69 | 61 |
| 2018 | 73 | 78 |
| 2019 | 51 | 65 |
| 2020 | 62 | 64 |
| 2021 | 49 | 65 |
| 2022 | 49 | 66 |
| 2023 | 43 | 37 |
| 2024 | 41 | 29 |
| 2025 | 33 | 26 |
| 2026 | 21 | 25 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Bonding wire for semiconductor devices8 Sep 2026US 12,733,530 B2Nippon Micrometal Corporation
- Bonding wire for semiconductor devices25 Aug 2026US 12,721,208 B2Nippon Micrometal Corporation
- Silicon carbide device and method for forming a silicon carbide device11 Aug 2026US 12,707,957 B2Infineon Technologies AG
- Semiconductor device11 Aug 2026US 12,707,998 B2Kabushiki Kaisha Toshiba
- Aluminum bonding wire for power semiconductor28 Jul 2026US 12,692,576 B2Mitsubishi Electric Corporation
- Microelectronic device package with open cavity1 Oct 2026US 2026/0305456 A1Texas Instruments Incorporated
- Automatic wire threading method and system27 Aug 2026US 2026/0250097 A1Asmpt Singapore Pte. Ltd.
- Capillary head with noncircular cone for wirebonding in semiconductor package manufacturing27 Aug 2026US 2026/0256014 A1
- Semiconductor package20 Aug 2026US 2026/0248045 A1Samsung Electronics Co., Ltd.
- Methods of determining a sequence for creating a plurality of wire loops in connection with a workpiece13 Aug 2026US 2026/0234412 A1Kulicke and Soffa Industries, Inc.
Most cited
By later US patents
- Semiconductor device475US 6,316,838 B1Fujitsu Limited · 2001
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Three dimensional high performance interconnection package422US 5,371,654 AInternational Business Machines Corporation · 1994
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999