H10W 72/07511
Treating the bonding area before connecting
Official title: {Treating the bonding area before connecting, e.g. by applying flux or cleaning}
H10W72/07511 (Treating the bonding area before connecting) appears on 1,103 US grants and 1,038 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,103
- Published applications
- 1,038
- Assignees
- 316
- Inventors
- 2,049
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 1 | 0 |
| 1978 | 4 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 3 | 0 |
| 1984 | 8 | 0 |
| 1985 | 3 | 0 |
| 1986 | 4 | 0 |
| 1987 | 5 | 0 |
| 1988 | 3 | 0 |
| 1989 | 6 | 0 |
| 1990 | 9 | 0 |
| 1991 | 9 | 0 |
| 1992 | 9 | 0 |
| 1993 | 9 | 0 |
| 1994 | 9 | 0 |
| 1995 | 17 | 0 |
| 1996 | 8 | 0 |
| 1997 | 15 | 0 |
| 1998 | 17 | 0 |
| 1999 | 32 | 0 |
| 2000 | 31 | 0 |
| 2001 | 59 | 28 |
| 2002 | 52 | 55 |
| 2003 | 36 | 47 |
| 2004 | 44 | 50 |
| 2005 | 30 | 61 |
| 2006 | 40 | 45 |
| 2007 | 23 | 68 |
| 2008 | 33 | 66 |
| 2009 | 34 | 59 |
| 2010 | 46 | 67 |
| 2011 | 52 | 56 |
| 2012 | 64 | 38 |
| 2013 | 39 | 37 |
| 2014 | 31 | 38 |
| 2015 | 42 | 40 |
| 2016 | 42 | 32 |
| 2017 | 31 | 43 |
| 2018 | 31 | 37 |
| 2019 | 32 | 24 |
| 2020 | 25 | 29 |
| 2021 | 17 | 27 |
| 2022 | 28 | 31 |
| 2023 | 18 | 20 |
| 2024 | 23 | 17 |
| 2025 | 16 | 12 |
| 2026 | 7 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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Most cited
By later US patents
- Methods for manufacturing a semiconductor package having a sacrificial layer553US 6,001,671 ATessera, Inc. · 1999
- Semiconductor device475US 6,316,838 B1Fujitsu Limited · 2001
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999
- Method for adding plasma treatment on bond pad to prevent bond pad staining problems353US 6,214,717 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2001