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US 2026/0179869 A1Published application
Packages with electrical fuses
OwnerMahmud Halim CHOWDHURY, Amin SIJELMASSI +5inventors
InventorsMahmud Halim CHOWDHURY, Amin SIJELMASSI, Murali KITTAPPA, Anindya PODDAR, Honglin GUO, Joe Adam GARCIA, John Paul TELLKAMP
Life of this patent
Estimating the term…
Abstract
In examples, a package comprises a semiconductor die having a device side and a bond pad on the device side, a conductive terminal exposed to an exterior of the package, and an electrical fuse. The electrical fuse comprises a conductive ball coupled to the bond pad, and a bond wire coupled to the conductive terminal. The bond wire is stitch-bonded to the conductive ball.
Claims15
A quad flat no lead (QFN) package, comprising:
- a semiconductor die including a bond pad;
- a conductive terminal including a portion;
- an electrical fuse comprising:
- a conductive ball on to the bond pad;
- and
- a bond wire including a first end coupled to the conductive ball and a second end ball bonded to the conductive terminal;
- and
- mold compound covering the electrical fuse, the semiconductor die, and the conductive terminal.
5 more elements
A semiconductor package, comprising:
- a semiconductor die including a bond pad;
- a conductive terminal including a portion exposed to an exterior of the package;
- and
- an electrical fuse comprising:
- a conductive ball on to the bond pad;
- and
- a bond wire ball bonded to the conductive terminal, and the bond wire stitch-bonded to the conductive ball.
4 more elements
Dependencies are inferred from the claim text.