Annular structure for an electronic flame off wand

A wire bonder, comprising:

• a capillary defining an aperture, wherein when performing wire bonding, a bond wire extends from the aperture;
• a heating means for heating the bond wire as the bond wire extends from the aperture;
• and
• a structure provided on a distal end of the heating means, the structure laterally extendable and retractable between a first position and a second position, wherein when the structure is in the second position, the structure is positioned below the capillary and uniformly provides heat to at least a portion of the bond wire when forming a free air ball (FAB).

A wire bonder, comprising:

• a capillary for extruding a bond wire during a wire bonding process;
• a heating device for heating the bond wire;
• and
• an annular structure associated with the heating device and defining a plurality of apertures on an inner surface of the annular structure, the annular structure positioned below the capillary while uniformly emitting annular energy from the plurality of apertures to at least a portion of the bond wire to form a free air ball (FAB).