Method of fabricating semiconductor package
AssigneeSK hynix Inc.
InventorHeon Yong CHANG
Life of this patent
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Abstract
A method of fabricating a semiconductor package according to embodiments of the present disclosure may include: disposing a semiconductor chip on a first molding layer; forming a vertical wire on a chip pad of the semiconductor chip; forming, with the vertical wire fixed with a holder, a second molding layer on the first molding layer such that the second molding layer seals the semiconductor chip and the vertical wire; removing the holder; and forming a redistribution layer on the second molding layer and the vertical wire.
Claims17
A method of fabricating a semiconductor package, the method comprising:
- disposing a semiconductor chip on a first molding layer;
- forming a vertical wire on a chip pad of the semiconductor chip;
- forming, with the vertical wire fixed with a holder, a second molding layer on the first molding layer such that the second molding layer seals the semiconductor chip and the vertical wire;
- removing the holder;
- and
- forming a redistribution layer on the second molding layer and the vertical wire.
A method of fabricating a semiconductor package, the method comprising:
- disposing a first semiconductor chip on a first molding layer, the first semiconductor chip having a first chip pad;
- offset-stacking a second semiconductor chip on the first semiconductor chip so that the first chip pad is exposed, the second semiconductor chip having a second chip pad;
- forming a first vertical wire on the first chip pad, and forming a second vertical wire on the second chip pad;
- forming, with the first and second vertical wires fixed with a holder, a second molding layer on the first molding layer such that the second molding layer seals the first and second semiconductor chips and the first and second vertical wires;
- removing the holder;
- and
- forming a redistribution layer on the second molding layer and the first and second vertical wires.
A method of fabricating a semiconductor package, the method comprising:
- offset stacking a plurality of semiconductor chips, each of the plurality of semiconductor chips having a chip pad, so that each chip pad is exposed;
- forming vertical wires on each of the chip pads;
- forming, with the vertical wires of the plurality of semiconductor chips fixed with a holder, a molding layer that seals the plurality of semiconductor chips and the vertical wires;
- removing the holder;
- and
- forming a redistribution layer on the second molding layer and the vertical wires, wherein the redistribution layer includes redistribution patterns with an alignment margin based on a fixed position of each of the vertical wires.
Dependencies are inferred from the claim text.