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US 12,635,549 B2Granted
Bump-forming device, bump-forming method, and non-transitory computer-readable medium
AssigneeYamaha Robotics Co., Ltd.
InventorKiyotaka Tanaka
Life of this patent
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Abstract
A bump-forming device includes a bonding tool and a bonding controller. The bonding controller is configured to execute a crimping step, a delivery step, a pressing step, and a cutting step, and of the trajectories of the bonding tool, at least the trajectory in the delivery step is determined on the basis of a first parameter relating to a wire (w) and a second parameter relating to the shape of the bonding tool.
Claims9
A bump-forming device comprising:
- a bonding tool bonding a wire to a bond point as a bonding target;
- and
- a bonding controller controlling the bonding tool to form a bump on the bond point,
- wherein
- the bonding controller is configured to execute:
- a crimping step in which a ball part formed at a tip of the wire extending from a tip of the bonding tool is crimped to the bond point by the tip of the bonding tool;
- a delivery step in which the bonding tool is moved while the wire is delivered from the ball part crimped to the bond point;
- a pressing step in which a portion of the ball part crimped to the bond point is pressed by the tip of the bonding tool, and the ball part crimped to the bond point is deformed;
- and
- a cutting step in which the wire is cut and the bump is formed on the bond point;
- based on a first parameter relating to the wire and a second parameter relating to shape of the bonding tool, at least a trajectory in the delivery step in the trajectory of the bonding tool is determined;
- wherein the first parameter comprises a diameter of the ball part before being crimped and a diameter and a thickness of a crimp lower portion of the ball part crimped to the bond point, the crimp lower portion being formed between the bonding tool and the bond point;
- and
- wherein the second parameter comprises a hole diameter of a hole of the bonding tool through which the wire is inserted, and a chamfer diameter and a chamfer angle of a chamfer provided on a tip side of the hole of the bonding tool.
11 more elements
A bump-forming method comprising:
- a crimping step in which a ball part formed at a tip of a wire extending from a tip of a bonding tool is crimped to a bond point by the tip of the bonding tool;
- a delivery step in which the bonding tool is moved while the wire is delivered from the ball part crimped to the bond point;
- a pressing step in which a portion of the ball part crimped to the bond point is pressed by the tip of the bonding tool, and the ball part crimped to the bond point is deformed;
- and
- a cutting step in which the wire is cut and a bump is formed on the bond point,
- wherein
- based on a first parameter relating to the wire and a second parameter relating to shape of the bonding tool, at least a trajectory in the delivery step in the trajectory of the bonding tool is determined;
- wherein the first parameter comprises a diameter of the ball part before being crimped and a diameter and a thickness of a crimp lower portion of the ball part crimped to the bond point, the crimp lower portion being formed between the bonding tool and the bond point;
- and
- wherein the second parameter comprises a hole diameter of a hole of the bonding tool through which the wire is inserted, and a chamfer diameter and a chamfer angle of a chamfer provided on a tip side of the hole of the bonding tool.
7 more elements
A non-transitory computer-readable medium recording a bump-forming program that causes a computer to execute:
- crimping processing in which a ball part formed at a tip of a wire extending from a tip of a bonding tool is crimped to a bond point by the tip of the bonding tool;
- delivery processing in which the bonding tool is moved while the wire is delivered from the ball part crimped to the bond point;
- pressing processing in which a portion of the ball part crimped to the bond point is pressed by the tip of the bonding tool, and the ball part crimped to the bond point is deformed;
- and
- cutting processing in which the wire is cut and a bump is formed on the bond point,
- wherein
- based on a first parameter relating to the wire and a second parameter relating to shape of the bonding tool, at least a trajectory in the delivery processing in the trajectory of the bonding tool is determined;
- wherein the first parameter comprises a diameter of the ball part before being crimped and a diameter and a thickness of a crimp lower portion of the ball part crimped to the bond point, the crimp lower portion being formed between the bonding tool and the bond point;
- and
- wherein the second parameter comprises a hole diameter of a hole of the bonding tool through which the wire is inserted, and a chamfer diameter and a chamfer angle of a chamfer provided on a tip side of the hole of the bonding tool.
7 more elements
Dependencies are inferred from the claim text.