H10W 72/072
Of bump connectors
Official title: {of bump connectors}
H10W72/072 (Of bump connectors) appears on 24,750 US grants and 27,566 published applications in this corpus.
Search patents in H10W- Granted patents
- 24,750
- Published applications
- 27,566
- Assignees
- 2,657
- Inventors
- 27,752
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 12 | 0 |
| 1977 | 10 | 0 |
| 1978 | 8 | 0 |
| 1979 | 11 | 0 |
| 1980 | 14 | 0 |
| 1981 | 15 | 0 |
| 1982 | 12 | 0 |
| 1983 | 10 | 0 |
| 1984 | 11 | 0 |
| 1985 | 12 | 0 |
| 1986 | 12 | 0 |
| 1987 | 28 | 0 |
| 1988 | 23 | 0 |
| 1989 | 37 | 0 |
| 1990 | 55 | 0 |
| 1991 | 61 | 0 |
| 1992 | 66 | 0 |
| 1993 | 90 | 0 |
| 1994 | 132 | 0 |
| 1995 | 118 | 0 |
| 1996 | 119 | 0 |
| 1997 | 152 | 0 |
| 1998 | 280 | 0 |
| 1999 | 331 | 0 |
| 2000 | 399 | 0 |
| 2001 | 534 | 257 |
| 2002 | 551 | 714 |
| 2003 | 619 | 679 |
| 2004 | 577 | 871 |
| 2005 | 591 | 987 |
| 2006 | 691 | 1041 |
| 2007 | 655 | 1070 |
| 2008 | 602 | 1096 |
| 2009 | 619 | 1098 |
| 2010 | 869 | 960 |
| 2011 | 903 | 937 |
| 2012 | 861 | 931 |
| 2013 | 909 | 1027 |
| 2014 | 963 | 1139 |
| 2015 | 1022 | 1298 |
| 2016 | 1175 | 1132 |
| 2017 | 1200 | 1172 |
| 2018 | 1085 | 1113 |
| 2019 | 1097 | 1298 |
| 2020 | 1145 | 1482 |
| 2021 | 1076 | 1504 |
| 2022 | 1181 | 1426 |
| 2023 | 1208 | 1333 |
| 2024 | 1061 | 1340 |
| 2025 | 994 | 1089 |
| 2026 | 544 | 572 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10W 72/07251Characterised by changes in properties of the bump connectors during connecting12,565
- H10W 72/07231Techniques9,724
- H10W 72/07202Using auxiliary members2,562
- H10W 72/07221Aligning1,744
- H10W 72/07211Treating the bond pad before connecting383
- H10W 72/07261With the bump connectors facing upwards, i.e. not in flip-chip orientation3
- H10W 72/07241Controlling the environment1
Recent patents
- Bonding head and bonding apparatus6 Oct 2026US 12,752,380 B2Pac Tech—Packaging Technologies GmbH
- Image sensor package including a chip stack structure6 Oct 2026US 12,757,506 B2Samsung Electronics Co., Ltd.
- Wire bonding using in-situ plasma treatment and apparatus for effecting the same6 Oct 2026US 12,757,746 B2Taiwan Semiconductor Manufacturing Company.Ltd
- TSV-type embedded multi-die interconnect bridge enabling with thermal compression non-conductive film (TC-NCF) process6 Oct 2026US 12,757,761 B2Intel Corporation
- Wiring board, semiconductor device, and method for manufacturing semiconductor device6 Oct 2026US 12,757,762 B2Kioxia Corporation
- Package structure and method for forming the same8 Oct 2026US 2026/0313918 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor chip, chip stacked structure and semiconductor package including the same8 Oct 2026US 2026/0314405 A1Samsung Electronics Co., Ltd.
- Integrated circuit packages and methods of forming the same8 Oct 2026US 2026/0314441 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package including connecting pads8 Oct 2026US 2026/0314451 A1Samsung Electronics Co., Ltd.
- Flip-chip package with pre-molded leadframe8 Oct 2026US 2026/0314454 A1Navitas Semiconductor Limited
Most cited
By later US patents
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Stacked semiconductor devices and methods of forming same1,870US 9,496,189 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Three dimensional structure memory1,560US 5,915,167 AElm Technology Corporation · 1999
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Package systems having interposers1,064US 9,048,233 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015