H10W 72/07221
Aligning
Official title: {Aligning}
H10W72/07221 (Aligning) appears on 1,744 US grants and 1,862 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,744
- Published applications
- 1,862
- Assignees
- 530
- Inventors
- 3,057
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 4 | 0 |
| 1991 | 5 | 0 |
| 1992 | 3 | 0 |
| 1993 | 7 | 0 |
| 1994 | 13 | 0 |
| 1995 | 13 | 0 |
| 1996 | 5 | 0 |
| 1997 | 10 | 0 |
| 1998 | 11 | 0 |
| 1999 | 27 | 0 |
| 2000 | 35 | 0 |
| 2001 | 33 | 11 |
| 2002 | 28 | 65 |
| 2003 | 54 | 52 |
| 2004 | 37 | 50 |
| 2005 | 42 | 59 |
| 2006 | 46 | 89 |
| 2007 | 44 | 92 |
| 2008 | 41 | 58 |
| 2009 | 52 | 77 |
| 2010 | 62 | 78 |
| 2011 | 67 | 91 |
| 2012 | 69 | 79 |
| 2013 | 72 | 94 |
| 2014 | 81 | 90 |
| 2015 | 100 | 124 |
| 2016 | 111 | 93 |
| 2017 | 112 | 116 |
| 2018 | 97 | 77 |
| 2019 | 86 | 81 |
| 2020 | 68 | 87 |
| 2021 | 68 | 96 |
| 2022 | 50 | 69 |
| 2023 | 71 | 52 |
| 2024 | 59 | 33 |
| 2025 | 32 | 37 |
| 2026 | 17 | 12 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Display panel having sub-pixels with different orienting characteristics, and a manufacturing method thereof22 Sep 2026US 12,745,607 B2AUO Corporation
- Deformable semiconductor device connection25 Aug 2026US 12,721,202 B2Intel Corporation
- Semiconductor device and method for manufacturing the same18 Aug 2026US 12,713,949 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method of producing micro-LED panel4 Aug 2026US 12,702,039 B2Sharp Display Technology Corporation
- Verifying alignment of multiple die on a substrate21 Jul 2026US 12,690,412 B2International Business Machines Corporation
- Flip-chip bonding with tilt feedback27 Aug 2026US 2026/0256004 A1IQM Finland Oy
- Semiconductor chip alignment method, bonding method, electronic component manufacturing device, and electronic component manufacturing system30 Jul 2026US 2026/0223714 A1Tokyo University of Science Foundation
- Apparatus configured to bond an electronic component23 Jul 2026US 2026/0215212 A1Micraft System Plus Co., Ltd.
- Device for holding a substrate and a method and apparatus for forming an electronic module9 Jul 2026US 2026/0198359 A1JCET STATS ChipPAC Korea Limited
- Self-aligned pick and place methods and apparatuses2 Jul 2026US 2026/0190952 A1Intel Corporation
Most cited
By later US patents
- Three-dimensional chip stacking assembly678US 6,355,501 B1International Business Machines Corporation · 2002
- Method for fabricating stackable chip scale semiconductor package676US 6,235,554 B1Micron Technology, Inc. · 2001
- Process of fabricating three-dimensional semiconductor device576US 4,612,083 ANEC Corporation · 1986
- Barrier structure against corrosion and contamination in three-dimensional (3-D) wafer-to-wafer vertical stack497US 6,661,085 B2Intel Corporation · 2003
- Dielectric recess for wafer-to-wafer and die-to-die metal bonding and method of fabricating the same497US 6,887,769 B2Intel Corporation · 2005