Deformable semiconductor device connection

An electronic system, comprising:

• a first plate-like element having a first substantially planar connection surface with a first connection pad;
• a second plate-like element having a second substantially planar connection surface with a second connection pad corresponding to the first connection pad;
• a connection electrically and physically coupling the first and second plate-like elements and arranged between the first and second connection pads, comprising:
• a deformed elongate element arranged on the first connection pad and extending to the second connection pad;
• and
• solder in contact with the second connection pad and the elongate element, and an electrical component electrically coupled to the first plate-like element;
• wherein a melting point of the elongate element is higher than the solder and the elongate element does not comprise solder.

A device, comprising:

• a circuit board comprising first connection pads;
• a die coupled to the circuit board and comprising second connection pads;
• a plurality of elongate elements, each elongate element coupled to a respective first connection pad of the circuit board and extending toward a corresponding second connection pad of the die;
• and
• solder in contact with corresponding pairs of elongate elements and second connection pads, wherein a melting point of the elongate elements is higher than the solder and the elongate element does not comprise solder.