H10W 72/07223
Active alignment
Official title: {Active alignment, e.g. using optical alignment using marks or sensors}
H10W72/07223 (Active alignment) appears on 504 US grants and 582 published applications in this corpus.
Search patents in H10W- Granted patents
- 504
- Published applications
- 582
- Assignees
- 221
- Inventors
- 1,038
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 2 | 0 |
| 2000 | 4 | 0 |
| 2001 | 3 | 2 |
| 2002 | 6 | 5 |
| 2003 | 8 | 6 |
| 2004 | 2 | 5 |
| 2005 | 2 | 8 |
| 2006 | 10 | 14 |
| 2007 | 7 | 18 |
| 2008 | 8 | 20 |
| 2009 | 8 | 22 |
| 2010 | 24 | 21 |
| 2011 | 14 | 25 |
| 2012 | 10 | 20 |
| 2013 | 25 | 30 |
| 2014 | 25 | 26 |
| 2015 | 37 | 52 |
| 2016 | 37 | 40 |
| 2017 | 47 | 47 |
| 2018 | 34 | 37 |
| 2019 | 39 | 39 |
| 2020 | 26 | 30 |
| 2021 | 35 | 36 |
| 2022 | 19 | 24 |
| 2023 | 24 | 19 |
| 2024 | 25 | 16 |
| 2025 | 13 | 13 |
| 2026 | 5 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Display panel having sub-pixels with different orienting characteristics, and a manufacturing method thereof22 Sep 2026US 12,745,607 B2AUO Corporation
- Electronic component bonding machines, and methods of measuring a distance on such machines7 Apr 2026US 12,599,020 B2Kulicke and Soffa Industries, Inc.
- Manufacturing apparatus and manufacturing method of semiconductor device24 Feb 2026US 12,563,999 B2Yamaha Robotics Co., Ltd.
- Flip chip bonding for semiconductor packages using metal strip10 Feb 2026US 12,550,751 B2Infineon Technologies AG
- Die-beam alignment for laser-assisted bonding13 Jan 2026US 12,525,557 B2STATS ChipPAC Pte. Ltd.
- Flip-chip bonding with tilt feedback27 Aug 2026US 2026/0256004 A1IQM Finland Oy
- Semiconductor chip alignment method, bonding method, electronic component manufacturing device, and electronic component manufacturing system30 Jul 2026US 2026/0223714 A1Tokyo University of Science Foundation
- Apparatus configured to bond an electronic component23 Jul 2026US 2026/0215212 A1Micraft System Plus Co., Ltd.
- Heat transfer coupler for semiconductor package assembly processes2 Jul 2026US 2026/0191069 A1Intel Corporation
- Using electrical current measurement to determine alignment of integrated circuit structures during bonding28 May 2026US 2026/0150700 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Three-dimensional chip stacking assembly678US 6,355,501 B1International Business Machines Corporation · 2002
- Process of fabricating three-dimensional semiconductor device576US 4,612,083 ANEC Corporation · 1986
- Barrier structure against corrosion and contamination in three-dimensional (3-D) wafer-to-wafer vertical stack497US 6,661,085 B2Intel Corporation · 2003
- Dielectric recess for wafer-to-wafer and die-to-die metal bonding and method of fabricating the same497US 6,887,769 B2Intel Corporation · 2005
- 3D IC method and device388US 7,485,968 B2Ziptronix, Inc. · 2009