Flip-chip bonding with tilt feedback
AssigneeIQM Finland Oy
InventorsVladimir MILCHAKOV, Eelis TAKALA, Máté JENEI
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Abstract
A method for a flip-chip bonding system, where a chip is pressed toward a mounting surface by applying pressure on the chip. A tilt angle is measured between the chip and the mounting surface while the chip is being pressed toward the mounting surface. If the measured tilt angle differs from a predetermined threshold, the tilt angle is adjusted by adjusting the pressure distribution while the chip is being pressed toward the mounting surface.
Claims16
A method for attaching a chip on a mounting surface in a flip-chip bonding system, comprising
- pressing the chip toward the mounting surface by applying pressure on the chip, wherein said pressure has a spatial distribution across the surface of the chip,
- measuring a tilt angle between the chip and the mounting surface while the chip is being pressed toward the mounting surface,
- comparing the measured tilt angle to a predetermined threshold and, if the measured tilt angle differs from the threshold, adjusting the tilt angle by adjusting the pressure distribution while the chip is being pressed toward the mounting surface.
A flip-chip bonding apparatus comprising an actuator coupled to a chip and a control unit coupled to the actuator, whereby the control unit is configured to control the actuator so that it presses the chip toward a mounting surface, wherein a pressure applied by the actuator has a spatial pressure distribution across the surface of the chip, wherein the apparatus also comprises a measurement arrangement coupled to the control unit, and the measurement arrangement is configured to measure a tilt angle between the chip and the mounting surface when the actuator presses the chip toward the mounting surface, wherein the control unit is configured to adjust the tilt of the chip by adjusting the pressure distribution based on the measured tilt angle.
A method of using a superconducting circuit on a chip or on a mounting surface for measuring a tilt angle between the chip and the mounting surface while the chip is being pressed toward the mounting surface in a flip-chip bonding process, wherein the superconducting circuit comprises a co-planar waveguide resonator in two or more measurement locations where a gap between the chip and the mounting surface is measured, and the use comprises measuring a resonance frequency of each coplanar waveguide resonator.
(canceled)
Dependencies are inferred from the claim text.