Heat transfer coupler for semiconductor package assembly processes

A device comprising:

• a body comprising a solid material wherein the body has a first face that is opposite a second face;
• first non-continuous channels in the first face;
• second non-continuous channels in the second face;
• and
• a plurality of vias that interconnect the first non-continuous channels with the second non-continuous channels.

A method comprising:

• placing a substrate and semiconductor chips that are to be electrically coupled in a manufacturing tool wherein the manufacturing tool comprises:
• a heater, and
• a heat transfer coupler comprising a first face and a second face, wherein the first face is opposite the second face, wherein the heat transfer coupler comprises first non-continuous channels in the first face, wherein the heat transfer coupler comprises second non-continuous channels in the second face, wherein a plurality of vias interconnect the first non-continuous channels with the second non-continuous channels, wherein semiconductor chips are attached to the second face through a vacuum applied through the second non-continuous channels, and wherein the second non-continuous channels do not cross an edge of the semiconductor chips;
• and
• applying heat to the first face of the heat transfer coupler, to cause electrical connections to be formed between the semiconductor chip and the substrate.