Flip chip bonding for semiconductor packages using metal strip

A method of forming one or more semiconductor packages, the method comprising:

• providing a metal strip;
• mounting one or more semiconductor dies on the metal strip such that the one or more semiconductor dies are in a flip chip arrangement whereby terminals of the one or more semiconductor dies face the upper surface of the metal strip;
• forming an electrically insulating encapsulant material on the upper surface of the metal strip that encapsulates the one or more semiconductor dies;
• and
• forming package terminals that are electrically connected with the terminals of the one or more semiconductor dies,
• wherein the package terminals are formed from the metal strip,
• wherein mounting the one or more semiconductor dies comprises providing solder regions between the terminals of the one or more semiconductor dies and the upper surface of the metal strip and performing a solder process that reflows the solder regions, and wherein the solder process forms intermetallic regions at an interface between the solder regions and the upper surface of the metal strip,
• wherein the package terminals are formed by performing a masked etching of the metal strip, and wherein the package terminals are formed from structured parts of the metal strip that remain after the masked etching.