Verifying alignment of multiple die on a substrate

A method of verifying alignment of electronic structures to laminates comprising:

• providing an assembly comprising an electronic module situated on a laminate structure to be joined to said electronic module, the electronic module having a first alignment marker at a first location on or in the electronic module and the laminate structure having a second alignment marker at a second location on or in the laminate structure, said first location and second location being separated by a distance greater than a 0.5*die size apart;
• providing incident infrared (IR) light to said assembly from a location above said assembly;
• obtaining images based on IR light reflected from the assembly, the obtained images including a concurrent relative positioning of the first location of the first alignment marker and the second location of the second alignment marker;
• detecting, based on the concurrent relative positioning of the first location of the first alignment marker and the second location of the second alignment marker, a degree of alignment between the electronic module and the laminate structure;
• and
• one of:
• performing, based on the detected degree of alignment, a solder reflow process to electrically join the electronic module to the laminate structure or alternatively to prevent the reflow process,
• wherein said second alignment marker comprises one or more reference guides facilitating, by an operator, an immediate visual measure of the degree of alignment between said electronic module and the laminate structure, a reference guide indicating a degree of alignment of a granularity ranging between an exact alignment, a mis-alignment correlated to an acceptable limit of self-alignment during solder reflow process that instructs performing the solder reflow process, or a mis-alignment exceeding an acceptable limit of self-alignment that instructs not performing the solder reflow process.

An apparatus for verifying an alignment of an electronic module to a laminate structure, the apparatus comprising:

• an in-line infrared (IR) inspection apparatus comprising:
• an infrared (IR) light source;
• and
• an IR camera for receiving reflected IR light,
• the IR light source disposed vertically above a carrier holding an assembly comprising an electronic module situated on a laminate structure to be joined to said electronic module, the electronic module having a first alignment marker at a first location on or in the electronic module and the laminate structure having a second alignment marker at a second location on or in the laminate structure, the first location of the first alignment marker and second location of the second alignment marker being separated by a pre-determined distance greater than a 0.5*die size apart, and
• the IR light source providing incident IR light upon the carrier and the IR camera receiving reflected IR light signals providing images comprising a concurrent relative positioning of the first location of the first alignment marker relative to the second location of the second alignment marker, wherein the alignment of the electronic module to said laminate structure is verified or not verified based on the relative locations of the first alignment marker and second alignment marker,
• wherein said second alignment marker comprises one or more reference guides facilitating, by an operator, an immediate visual measure of the degree of alignment between said electronic module and the laminate structure, a reference guide indicating a degree of alignment of a granularity ranging between an exact alignment, a mis-alignment correlated to an acceptable limit of self-alignment during solder reflow process that instructs performing the solder reflow process, or a mis-alignment exceeding an acceptable limit of self-alignment that instructs not performing the solder reflow process.