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US 2026/0190952 A1Published application
Self-aligned pick and place methods and apparatuses
AssigneeIntel Corporation
InventorsYi SHI, Feras EID, Xavier BRUN, Charles EL HELOU
Life of this patent
Estimating the term…
Abstract
In some embodiments, pick and place tools can pick and place multiple dies with different die sizes from different source wafers at a time to increase the throughput. In addition, some of these tools may incorporate non-contact die handling during pick and place processes. In some examples, the non-contact mechanisms can use Bernoulli effects or acoustic wave or vibration techniques to hold and release dies.
Claims20
An apparatus comprising:
- a fluid dispensing assembly to:
- (i) dispense first amounts of water onto first hydrophilic regions of a first semiconductor wafer at a first point in time, the first hydrophilic regions having a first arrangement, and
- (ii) dispense second amounts of water onto second hydrophilic regions of a second semiconductor wafer at a second point in time different than the first point in time, the second hydrophilic regions having a second arrangement different than the first arrangement;
- and
- a pick-and-place assembly to:
- (i) using at least one non-contact nozzle to position, at the first point in time, a first batch of dies onto the first amounts of water dispensed on the first semiconductor wafer, the first batch of dies corresponding to the first arrangement of the first hydrophilic regions;
- and
- (ii) using the at least one non-contact nozzle to position, at the second point in time, a second batch of dies onto the second amounts of water dispensed on the second semiconductor wafer, the second batch of dies corresponding to the second arrangement of the second hydrophilic regions.
5 more elements
A method comprising:
- dispensing first amounts of water on respective ones of first hydrophilic regions of a first semiconductor wafer at a first point in time, the first hydrophilic regions having a first arrangement;
- positioning, at the first point in time, using non-contact nozzles, a first set of dies on the first amounts of water on the first semiconductor wafer, the first set of dies dimensioned and spaced apart according to the first arrangement of the first hydrophilic regions;
- dispensing second amounts of water on respective ones of second hydrophilic regions of a second semiconductor wafer at a second point in time, the second hydrophilic regions having a second arrangement different than the first arrangement;
- and
- positioning, at the second point in time, using the non contact nozzles, a second set of dies on the second amounts of water on the second semiconductor wafer, the second set of dies dimensioned and spaced apart according to the second arrangement of the second hydrophilic regions.
2 more elements
An apparatus comprising:
- means for dispensing water to:
- dispense water onto first hydrophilic regions of a first semiconductor wafer at a first point in time, the first hydrophilic regions distributed across a first area;
- and
- dispense water onto second hydrophilic regions of a second semiconductor wafer at a second point in time different than the first point in time, the second hydrophilic regions distributed across a second area, the first and second areas having a same size and a same shape, at least one of a size, a shape, an orientation, or a placement of ones of the first hydrophilic regions within the first area to be different than at least one of a size, a shape, an orientation, or a placement of ones of the second hydrophilic regions within the second area;
- and
- means for positioning to:
- position a first plurality of dies on the first hydrophilic regions, the water on the first hydrophilic regions to facilitate alignment of the first plurality of dies to the first hydrophilic regions;
- and
- position a second plurality of dies on the second hydrophilic regions, the water on the second hydrophilic regions to facilitate alignment of the second plurality of dies to the second hydrophilic regions.
6 more elements
Dependencies are inferred from the claim text.